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IEEE SSE 2024

IEEE International Conference on Software Services Engineering
Shenzhen, China  |  Summer 2024

SSE Keynote
Enhancing the Proactive and Intelligent Evolution Capacity of Complex Distributed Microservice Systems

Zhongjie Wang, Harbin Institute of Technology

As microservice technology is widely applied in fields such as smart cities and industrial Internet, the challenges of efficiently and flexibly adapting to evolving demands and environments become increasingly prominent due to the expansion of system scale. There is an urgent need for such complex software service systems to possess efficient adaptive capabilities. The rapid development of artificial intelligence technology offers new possibilities for addressing this challenge. In this keynote, a series of key technologies for the evolution of microservice systems based on the MAPE-K model will be detailed. These include simulation and prediction methods for evolution scenario evaluation, optimization methods for addressing performance and functional defects in complex dependent microservice systems, frameworks and architectures supporting adaptive evolution in response to user demand changes, and a collaborative operation and evolution platform for distributed complex microservice systems in cloud-edge environments. Furthermore, an adaptive evolution method for microservice systems using AI will be introduced, sharing our attempts and prospects regarding the integration of artificial intelligence technology with adaptive evolution methods.

Zhongjie Wang, a professor at Harbin Institute of Technology, serves as the Director of the Faculty of Computing and Dean of the School of Computer Science and Technology. He is an outstanding member of the China Computer Federation (CCF), serving as the Director of the CCF Technical Committee of Services Computing and the Director of the Ministry of Education’s Virtual Teaching and Research Room for Software Engineering. Additionally, he holds the position of Executive Vice Dean at the Harbin Institute of Technology-China Mobile 5G Application Innovation Joint Research Institute. He is currently leading the construction of the National Artificial Intelligence Industry-Education Integration Innovation Platform. His primary research interests include service engineering, internet services and cloud computing, software service engineering, and industrial software. He focuses on research in requirement engineering, modeling, simulation, design, business analysis optimization, construction operation, and governance of various manufacturing and service systems in Internet/cloud/edge/mobile environments. He has made breakthroughs in Internet of Services architecture, service ecosystem, service/industry value chain, cloud-edge collaborative industrial software intelligent operation and evolution, among other areas. Over the past five years, he has published more than 50 high-quality papers in prestigious journals and conferences such as IEEE TSC, TCC, TNNLS, JSS, FGCS, ICWS, and ICSOC. He has received awards such as the Best Paper Award at IEEE APSEC 2016 and CCF ICSS 2020, the Best Student Paper Award at IEEE SCC 2021, the Special Paper Award at IEEE ICWS 2021, and the Best Paper Award at the 2022 China Digital Service Conference. He serves as the Chair or Co-Chair of the Program Committees and Organizing Committees for international conferences including IEEE SERVICES, ICWS, SCC, ICSOC, and SOSE. He has filed over 40 patent applications and has been granted 10 patents. He is the Chief Scientist of the National Key Research and Development Program “Industrial Software” and has undertaken more than ten projects including the National 863 Program, the National Natural Science Foundation, and key research and development projects. He has authored several books and textbooks, including “Service Engineering and Methodology,” “Big Services and Internet of Services,” and “Ten Lectures on Services Computing.” He was selected for the Excellent Teacher Award Program in the field of computer science for the academic years 2022-2023.